By Suryadevara Babu
Advances in Chemical Mechanical Planarization (CMP) provides the most recent info on a mainstream approach that's severe for high-volume, high-yield semiconductor production, or even extra in order machine dimensions proceed to slash. The know-how has grown to surround the removing and planarization of a number of steel and dielectric fabrics and layers either on the machine and the metallization degrees, utilizing diverse instruments and parameters, requiring advancements within the keep an eye on of topography and defects.
This very important e-book deals a scientific evaluation of basics and advances within the region. half One covers CMP of dielectric and steel motion pictures, with chapters targeting using specific concepts and approaches, and on CMP of specific a variety of fabrics, together with extremely low-k fabrics and high-mobility channel fabrics, and finishing with a bankruptcy reviewing the environmental affects of CMP tactics.
Part addresses consumables and approach keep an eye on for more desirable CMP, and comprises chapters at the coaching and characterization of slurry, diamond disc pad conditioning, using FTIR spectroscopy for characterization of floor techniques, and ways for defection characterization, mitigation, and reduction.
- Considers options and methods for CMP of dielectric and steel films
- Includes chapters dedicated to CMP for specific materials
- Addresses consumables and approach keep watch over for more desirable CMP
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Additional info for Advances in Chemical Mechanical Planarization (CMP) (Woodhead Publishing Series in Electronic and Optical Materials)
Advances in Chemical Mechanical Planarization (CMP) (Woodhead Publishing Series in Electronic and Optical Materials) by Suryadevara Babu